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Copper Base PCB – FN09

MOQ :1000 piece

Lead Time :2 Days

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Payment : L/C,T/T,Western Union, Money Gram, Credit Card, Paypal

Product details

Product Specifications

  • Brand name:领卓

Product Description

Product Specification:

Copper foil:1oz
Legend color:black
Surface finish:OSP
Board Thickness:2.0mm
Material:copper core laminate
Solder mask/resist:photoimageable and colored white
Break Down Voltage for Insulated Layer:4kV
Thermal Conductivity for Insulated Layer:3.0W/m-K

What is a Metal Core PCB (MCPCB)?
MCPCB also known as a thermal PCB or metal backed PCB, is a type of PCB that has a metal material as its base for the heat spreader portion of the board. The thick metal (almost always aluminum or copper) is covering 1 side of the PCB. Metal core can be in reference to the metal, being either in the middle somewhere or on the back of the board. The purpose of the core of an MCPCB is to redirect heat away from critical board components and to less crucial areas such as the metal heatsink backing or metallic.

The benefits of the metal core PCBs

■Excellent thermal dissipation
Thermal conductivity refers to the thermal performance parameters of a material. The thermal conductivity of Metal core PCBs like aluminum PCBs exhibits higher than other PCBs that use FR4 and CEM3 as the substrates. High thermal conductivity makes metal core PCBs have an excellent heat dissipation ability. The heat produced by ICs and components will be removed quickly, which helps to reduce the heat damage of the components and prolong the service life of the products, as well as improve the performance.

■Good dimensional stability
Aluminum PCBs and copper PCBs have high CTE (the coefficient of thermal expansion). CTE refers to describe the expansion or contraction of material on heating. High CTE means the PCBs have a good thermal expansibility, and the board size will be little changed under the high temperature when compared to the normal FR4.

■Less distortion
Good heat dissipation of metal core PCBs makes them less prone to high temperature, which causes less distortion during signal transportation.


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